Regular Biparting Door
Regular Biparting doors are used in hoistways that have ample floor to floor height.
Each floor to floor height must be equal to or exceed 1.5 times the landing door height, plus 6 in. (150mm). Overhead height at the top landing must equal or exceed 1.5 times the landing door height, plus 4 in. (100mm). Pit depth must equal or exceed 0.5 times the landing door height, plus 4 in. (100mm), measured from the lowest landing sill.
Required car clearance between the elevator platform and building sill is 5 in. (125mm). Where any single floor to floor height is insufficient, use a Pass-Type Biparting hoistway door.
Pass-Type Biparting Door
Pass-Type Biparting doors are used in hoistways that have short floor to floor heights.
Floor to floor height must be equal to or exceed the landing door height plus 24 in. (610mm). Required overhead height and pit depth are the same as regular biparting doors.
Required car clearance between the elevator platform and building sill is 6.75 in. (170mm).
Extended Sill Biparting Door
Extended Sill Biparting doors are used in conjunction with Pass-Type doors. Extended sill doors have a regular door upper panel and a pass-type door lower panel.
Telco Upper Half Biparting Door
Telco Upper Half Biparting doors consist of an upper panel made from two separate panels which telescope upwards. These doors are used when hoistway overhead height is severely limited.
The minimum required overhead is equal to 1.25 times the top landing door opening height, plus 8 in. (330mm).
Compound 2:1 Biparting Door
Compound 2:1 Biparting doors consist of a lower door panel that is 1/2 the height of the upper panel. These doors are used when the hoistway pit is very shallow. Compound 2:1 biparting doors are available in regular or pass-type configurations.
The minimum pit depth is equal to 1/3 times the bottom landing door height plus 4 in. (100mm).
Please contact Peelle should your project specifications not meet the Peelle dimensional requirements. Peelle offers door solutions beyond the standards listed above to resolve dimensional and environmental challenges.