Regular Biparting Door
Regular Biparting doors are used in hoistways that have ample floor to floor height.
MIN. FLOOR TO FLOOR: 1.5 x OPENING HT + 150 mm [6 in]
MIN. PIT: 0.5 x OPENING HT + 102 mm [4 in]
RETURN SPACE: 330 mm [13 in] BOTH SIDES
CAR CLEARANCE: 127 mm [5 in]
Pass-Type Biparting doors
Pass-Type Biparting doors are used in hoistways that have short floor to floor heights.
WHEN FLOOR TO FLOOR IS LESS THAN 1.5 OPENING HT + 150 mm [6 in]
MIN. FLOOR TO FLOOR: OPENING HT + 381 mm [15 in]
MIN. PIT: 0.5 x OPENING HT + 102 mm [4 in]
RETURN SPACE: 330 mm [13 in] BOTH SIDES
CAR CLEARANCE: 171 mm [6 3/4 in]
Extended Sill Biparting Door
Extended Sill Biparting doors are used in conjunction with Pass-Type doors. Extended sill doors have a regular door upper panel and a pass-type door lower panel.
MIN. FLOOR TO FLOOR: 1.5 x OPENING HT + 150 mm [6 in]
MIN. PIT: 0.5 x OPENING HT + 102 mm [4 in]
RETURN SPACE: 330 mm [13 in] BOTH SIDES
CAR CLEARANCE: 171 mm [6 3/4 in]
Telco Upper Half Biparting Door
Telco Upper Half Biparting doors consist of an upper panel made from two separate panels which telescope upwards. These doors are used when hoistway overhead height is severely limited.
MIN. FLOOR TO FLOOR: 1.25 x OPENING HT + 330 mm [13 in]
MIN. PIT: 0.5 x OPENING HT + 102 mm [4 in]
RETURN SPACE: 330 mm [13 in] BOTH SIDES
CAR CLEARANCE: 171 mm [6 3/4 in]
Compound 2:1 Biparting Door
Compound 2:1 Biparting doors consist of a lower door panel that is 1/2 the height of the upper panel. These doors are used when the hoistway pit is very shallow. Compound 2:1 biparting doors are available in regular or pass-type configurations.
MIN. FLOOR TO FLOOR: 1.66 x OPENING HT + 150 mm [6 in]
MIN. PIT: 0.33 x OPENING HT + 102 mm [4 in]
RETURN SPACE: 330 mm [13 in] BOTH SIDES
CAR CLEARANCE: 127 mm [5 in]
MAX CAR LAP: 50 mm [2 in], BEFORE NOTCHING PLATFORM
Please contact Peelle should your project specifications not meet the Peelle dimensional requirements. Peelle offers door solutions beyond the standards listed above to resolve dimensional and environmental challenges.